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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11248086 B1

PDFFull Text
Date of Patent:
Feb. 15, 2022

Filed:

Apr. 17, 2019

Hard-mask forming composition and method for manufacturing electronic component

Applicant:

Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;

Inventors:

Keiichi Ibata, Kawasaki, JP;

Ryoji Watanabe, Kawasaki, JP;

Assignee:

Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;

Attorney:

Knobbe Martens Olson & Bear LLP

Primary Examiner:

Christopher M Rodd

Int. Cl.
CPC ...
C08G 61/12 (2006.01); G03F 7/004 (2006.01); C08L 61/06 (2006.01); C08G 8/04 (2006.01); C08G 16/02 (2006.01); C08L 61/34 (2006.01); G03F 7/075 (2006.01); G03F 7/09 (2006.01); H01L 21/02 (2006.01); H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
C08G 61/124 (2013.01); C08G 8/04 (2013.01); C08G 16/0268 (2013.01); C08L 61/06 (2013.01); C08L 61/34 (2013.01); G03F 7/0041 (2013.01); G03F 7/0752 (2013.01); G03F 7/094 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/0332 (2013.01); C08L 2205/02 (2013.01);
Abstract

A hard-mask forming composition, which is used for forming a hard mask used in lithography, including a first resin and a second resin, in which an amount of carbon contained in the first resin is 85% by mass or more with respect to the total mass of all elements constituting the first resin, and the amount of carbon contained in the second resin is 70% by mass or more with respect to the total mass of all elements constituting the second resin and less than the amount of carbon contained in the first resin.

Find Patent Forward Citations

Ibata, Keiichi. (2022). Hard-mask forming composition and method for manufacturing electronic component (U.S. Patent No. 11248086). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11248086

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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