The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Sep. 26, 2018
Applicant:

Xcelsis Corporation, San Jose, CA (US);

Inventors:

Belgacem Haba, Saratoga, CA (US);

Ilyas Mohammed, Santa Clara, CA (US);

Gabriel Z. Guevara, Gilroy, CA (US);

Min Tao, San Jose, CA (US);

Assignee:

Xcelsis Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); G06N 3/04 (2006.01); H05K 5/00 (2006.01); H05K 3/30 (2006.01); H05K 1/02 (2006.01); H05K 5/06 (2006.01); G06N 3/08 (2006.01); G06N 3/063 (2006.01); H05K 7/14 (2006.01); H05K 1/14 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0065 (2013.01); G06N 3/0481 (2013.01); G06N 3/063 (2013.01); G06N 3/08 (2013.01); H05K 1/028 (2013.01); H05K 1/14 (2013.01); H05K 1/189 (2013.01); H05K 3/303 (2013.01); H05K 5/0021 (2013.01); H05K 5/065 (2013.01); H05K 7/1444 (2013.01); H05K 1/0278 (2013.01); H05K 3/284 (2013.01); H05K 2201/047 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10522 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract

Configurable smart object systems with methods of making modules and contactors are provided. Example systems implement machine learning based on neural networks that draw low power for use in smart phones, watches, drones, automobiles, and medical devices. Example assemblies can be configured from pluggable, interchangeable modules that have compatible ports for interconnecting and integrating functionally dissimilar sensor systems. An example method includes mounting an element of a configurable machine learning assembly on a substrate, creating at least one fold in the substrate, folding the substrate at the fold into a housing of a module of the configurable machine learning assembly, and adding a molding material to the housing to at least partially fill the module of the configurable machine learning assembly. The example module construction may also form contactors on folded edges of the module for making physical and electrical contact with other modules of the smart object machine learning assembly.


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