The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2022
Filed:
Oct. 31, 2019
Applicant:
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
Inventors:
Ramasamy Chockalingam, Singapore, SG;
Juan Boon Tan, Singapore, SG;
Chee Kong Leong, Singapore, SG;
Ranjan Rajoo, Singapore, SG;
Xuesong Rao, Singapore, SG;
Xiaodong Li, Singapore, SG;
Assignee:
GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore, SG;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/03 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0518 (2013.01); H01L 2224/05076 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05163 (2013.01); H01L 2224/05164 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/35121 (2013.01);
Abstract
A semiconductor device is provided that includes a dielectric layer, a bond pad, a passivation layer and a planar barrier. The bond pad is positioned in the dielectric layer. The passivation layer is positioned over the dielectric layer and has an opening over the bond pad. The planar barrier is positioned on the bond pad.