The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2022
Filed:
Jan. 27, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Min-Chien Hsiao, Taichung, TW;
Chuei-Tang Wang, Taichung, TW;
Chao-Wen Shih, Hsinchu County, TW;
Han-Ping Pu, Taichung, TW;
Chieh-Yen Chen, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A package structure includes a die, an encapsulant, and a first redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The die includes a ground plane within the die. The encapsulant encapsulates the die. The first redistribution structure is over the active surface of the die. The first redistribution structure includes an antenna pattern electrically coupled with the ground plane. The antenna pattern is electrically connected to the die.