The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Feb. 26, 2019
Applicant:

Koh Young Technology Inc., Seoul, KR;

Inventors:

Se Rin Lee, San Diego, CA (US);

Jin Man Kang, San Diego, CA (US);

Joong Ki Jeong, Gwangmyeong-si, KR;

Jung Ho Son, Seoul, KR;

Min Cheol Yoon, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06T 7/521 (2017.01); G01B 11/22 (2006.01); G01N 21/956 (2006.01); H04N 5/225 (2006.01); G06T 7/586 (2017.01); G01B 11/24 (2006.01); G06N 3/08 (2006.01); H04N 5/247 (2006.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G01B 11/22 (2013.01); G01B 11/24 (2013.01); G01N 21/956 (2013.01); G06N 3/08 (2013.01); G06T 7/521 (2017.01); G06T 7/586 (2017.01); H04N 5/2256 (2013.01); H04N 5/247 (2013.01); G01N 2021/95638 (2013.01); G06T 2207/10028 (2013.01); G06T 2207/10152 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30141 (2013.01); H05K 13/081 (2018.08);
Abstract

A printed circuit board inspection apparatus can inspect a mounting state of a component by generating depth information on the component by using a pattern of light reflected from the component mounted on a printed circuit board received by an image sensor, generating two-dimensional image data for the component by using at least one of light of a first wavelength, light of a second wavelength, light of a third wavelength, and light of a fourth wavelength reflected from the component received by a first image sensor, inputting the depth information and the two-dimensional image data for the component into a machine learning-based model, obtaining depth information with reduced noise from the machine learning-based model, and using the noise-reduced information.


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