The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Dec. 14, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Wanjae Park, Albany, NY (US);

Lior Huli, Albany, NY (US);

Soo Doo Chae, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/20 (2006.01); H01L 21/027 (2006.01); G03F 7/075 (2006.01); G03F 7/09 (2006.01); G03F 7/11 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); G03F 7/0752 (2013.01); G03F 7/091 (2013.01); G03F 7/11 (2013.01); G03F 7/16 (2013.01); G03F 7/2022 (2013.01); G03F 7/70033 (2013.01); H01L 21/0274 (2013.01); H01L 21/0276 (2013.01);
Abstract

Embodiments of methods for patterning using enhancement of surface adhesion are presented. In an embodiment, a method for patterning using enhancement of surface adhesion may include providing an input substrate with an anti-reflective coating layer and an underlying layer. Such a method may also include performing a surface adhesion modification process on the substrate, the surface adhesion modification process utilizing a plasma treatment configured to increase an adhesion property of an anti-reflective coating layer without affecting downstream processes. In an embodiment, the method may also include performing a photoresist coating process, a mask exposure process, and a developing process to generate a target patterned structure in a photoresist layer on the substrate. In such embodiments, the method may include controlling operating parameters of the surface adhesion modification process to achieve target profiles of the patterned structure and substrate throughput objectives.


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