The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Mar. 07, 2019
Applicant:

Xcelsis Corporation, San Jose, CA (US);

Inventors:

Belgacem Haba, Saratoga, CA (US);

Ilyas Mohammed, Santa Clara, CA (US);

Gabriel Z. Guevara, Gilroy, CA (US);

Min Tao, San Jose, CA (US);

Assignee:

Xcelsis Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/71 (2011.01); H01R 43/20 (2006.01); H01R 13/24 (2006.01);
U.S. Cl.
CPC ...
H01R 12/716 (2013.01); H01R 13/24 (2013.01); H01R 43/205 (2013.01);
Abstract

Configurable smart object systems with grid or frame-based connectors are provided. Example systems implement machine learning based on neural networks that draw low power for use in smart phones, watches, drones, automobiles, and medical devices, for example. Example assemblies can be configured from pluggable, interchangeable modules that have compatible ports with magnetic electrical contacts for interconnecting and integrating functionally dissimilar sensor systems. An example system has a clip attachable to a substrate for securing a smart object module to the substrate, and a housing of the clip with a geometry for aligning electrical contacts of the smart object module with electrical contacts of the substrate. The clip may have a compliant layer to provide spring, resilience, or pressure to securing the smart object module to the substrate. The clip may also integrate features of a secure digital (SD) port and a universal serial bus (USB) port. The clip may be either permanently affixed to the substrate, or removable, to make an expandable smart object system.


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