The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Jun. 02, 2020
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Wen-Jung Tsai, Taichung, TW;
Chih-Hsien Chiu, Taichung, TW;
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/52 (2006.01); H01L 25/16 (2006.01); H01L 21/56 (2006.01); H01L 23/482 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/526 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/4824 (2013.01); H01L 25/16 (2013.01);
Abstract
Provided is a packaging structure, which includes a carrier and an electronic component, an antenna module and a connector disposed on the carrier, and a packaging layer encapsulating the electronic component and the connector. A portion of a surface of the connector is exposed from the packaging layer so as to facilitate the electrical connection with a motherboard of an electronic product. A method for fabricating the packaging structure is also provided.