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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11227776 B1

PDFFull Text
Date of Patent:
Jan. 18, 2022

Filed:

Dec. 28, 2016

Leadframe package with pre-applied filler material

Applicant:

Stmicroelectronics, Inc., Calamba, PH;

Inventors:

Jefferson Talledo, Calamba, PH;

Frederick Ray Gomez, Calamba, PH;

Assignee:

STMICROELECTRONICS, INC., Calamba, PH;

Attorney:

Seed Intellectual Property Law Group LLP

Primary Examiner:

Caleb E Henry

Assistant Examiner:

Dilinh P Nguyen

Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H01L 21/54 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4842 (2013.01); H01L 21/4825 (2013.01); H01L 21/54 (2013.01); H01L 21/78 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 24/83 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/181 (2013.01); H05K 2201/10628 (2013.01); H05K 2201/10992 (2013.01);
Abstract

Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

Find Patent Forward Citations

Talledo, Jefferson. (2022). Leadframe package with pre-applied filler material (U.S. Patent No. 11227776). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11227776

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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