The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2022
Filed:
Sep. 06, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Ming-Hung Chen, Kaohsiung, TW;
Yung I. Yeh, Kaohsiung, TW;
Chang-Lin Yeh, Kaohsiung, TW;
Sheng-Yu Chen, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 5/00 (2006.01); H05K 5/06 (2006.01); H05K 1/18 (2006.01); H05K 9/00 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0017 (2013.01); H05K 1/142 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 5/065 (2013.01); H05K 9/0022 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract
A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.