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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11222832 B1

PDFFull Text
Date of Patent:
Jan. 11, 2022

Filed:

Jul. 16, 2019

Power semiconductor device package

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Tiburcio Maldo, Consolacion, PH;

Keunhyuk Lee, Suzhou, CN;

Jerome Teysseyre, Scottsdale, AZ (US);

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);

Attorney:

Brake Hughes Bellermann LLP

Primary Examiner:

Cuong B Nguyen

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/367 (2013.01); H01L 23/3735 (2013.01); H01L 23/49503 (2013.01); H01L 23/49517 (2013.01); H01L 23/49562 (2013.01); H01L 23/5385 (2013.01);
Abstract

In a general aspect, an apparatus can include a leadframe. The apparatus can also include a first semiconductor die coupled with a first side of a first portion of the leadframe, and a second semiconductor die coupled with a second side of the first portion of the leadframe. The apparatus can also include a first substrate coupled with a second side of the first semiconductor die. The first substrate can be further coupled with a first side of a second portion of the leadframe and a first side of a third portion of the leadframe. The apparatus can also further include a second substrate coupled with a second side of the second semiconductor die. The second substrate can be further coupled with a second side of the second portion of the leadframe and a second side of the third portion of the leadframe.

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