The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Dec. 27, 2019
Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventors:

Yao-An Chung, Hsin-chu, TW;

Yuan-Chieh Chiu, Hsinchu County, TW;

Ting-Feng Liao, Hsin-chu, TW;

Kuang-Wen Liu, Hsin-chu, TW;

Kuang-Chao Chen, Hsin-chu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/115 (2017.01); H01L 27/11582 (2017.01); H01L 23/48 (2006.01); H01L 29/51 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 21/28 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/02532 (2013.01); H01L 21/02636 (2013.01); H01L 21/31111 (2013.01); H01L 21/76802 (2013.01); H01L 21/76831 (2013.01); H01L 21/76877 (2013.01); H01L 23/481 (2013.01); H01L 29/40117 (2019.08); H01L 29/513 (2013.01); H01L 29/518 (2013.01);
Abstract

A memory device includes a substrate. A first dielectric layer is disposed over the substrate. A plurality of conductive layers and a plurality of dielectric layers are alternately and horizontally disposed on the substrate. A channel column structure is disposed on the substrate and in the conductive layers and the dielectric layers. A side wall of the channel column structure is in contact with the plurality of conductive layers. A second dielectric layer covers the first dielectric layer. A conductive column structure is in the first and second dielectric layers, adjacent to the channel column structure, and in contact with one of the plurality of conductive layers. The conductive column structure includes a liner insulating layer as a shell layer.


Find Patent Forward Citations

Loading…