The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Jul. 18, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mukta G. Farooq, Hopewell Junction, NY (US);

Arvind Kumar, Chappaqua, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 27/06 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0688 (2013.01); H01L 25/0657 (2013.01); H01L 27/249 (2013.01); H01L 2225/06541 (2013.01);
Abstract

Three-dimensional (3D) semiconductor memory structures and methods of forming 3D semiconductor memory structures are provided. The 3D semiconductor memory structure includes a chip comprising a memory and Through-Silicon Vias (TSVs). The 3D semiconductor memory structure further includes a hardware accelerator arranged on and coupled face-to-face to the above chip. The 3D semiconductor memory structure also includes a substrate arranged under the under the (3D) semiconductor memory structure and the hardware accelerator and attached to the TSVs and external inputs and outputs of the memory chip and the hardware accelerator.


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