logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11211304 B1

PDFFull Text
Date of Patent:
Dec. 28, 2021

Filed:

Aug. 17, 2018

Assembly and method for mounting an electronic component to a substrate

Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Ralf Otremba, Kaufbeuren, DE;

Guenther Lohmann, Sattendorf, AT;

Bernd Schmoelzer, Radenthein, AT;

Fabian Schnoy, Regenstauf, DE;

Assignee:

Infineon Technologies Austria AG, Villach, AT;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

David E Graybill

Int. Cl.
CPC ...
H01L 23/32 (2006.01); H02M 7/00 (2006.01); H05K 7/20 (2006.01); H01L 23/08 (2006.01); H01L 21/50 (2006.01); H01L 23/40 (2006.01); H01L 23/495 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/32 (2013.01); H01L 21/50 (2013.01); H01L 23/08 (2013.01); H01L 23/40 (2013.01); H01L 23/4006 (2013.01); H01L 23/49503 (2013.01); H01L 23/49562 (2013.01); H02M 7/003 (2013.01); H05K 7/209 (2013.01); H01L 2021/60285 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract

In an embodiment, an assembly includes an electronic component, a fixing member, a resilient member and a substrate having a first surface. The electronic component includes a heat-generating semiconductor device, a die pad and a plastic housing. The heat-generating semiconductor device is mounted on a first surface of the die pad, and the die pad is at least partially embedded in the plastic housing. The resilient member is engaged under compression between an upper side of the electronic component and a lower surface of the fixing member and the fixing member secures the electronic component to the first surface of the substrate.

Find Patent Forward Citations

Otremba, Ralf. (2021). Assembly and method for mounting an electronic component to a substrate (U.S. Patent No. 11211304). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11211304

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…