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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11211246 B1

PDFFull Text
Date of Patent:
Dec. 28, 2021

Filed:

Feb. 28, 2019

Method and composition for selectively modifying base material surface

Applicant:

Jsr Corporation, Tokyo, JP;

Inventors:

Hiroyuki Komatsu, Tokyo, JP;

Tomohiro Oda, Tokyo, JP;

Hitoshi Osaki, Tokyo, JP;

Masafumi Hori, Tokyo, JP;

Takehiko Naruoka, Tokyo, JP;

Assignee:

JSR CORPORATION, Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Alexander G Ghyka

Int. Cl.
CPC ...
H01L 21/027 (2006.01); B05D 3/02 (2006.01); B05D 7/14 (2006.01); C09D 1/00 (2006.01); H01L 21/321 (2006.01); H01L 21/02 (2006.01); B05D 3/14 (2006.01); C09D 7/61 (2018.01); C08F 112/08 (2006.01); B05D 1/32 (2006.01); B05D 3/10 (2006.01); C08F 8/00 (2006.01); H01L 21/768 (2006.01); C09D 7/20 (2018.01); C09D 5/00 (2006.01); C09D 125/06 (2006.01); C09D 125/16 (2006.01); C09D 133/12 (2006.01); C09D 183/04 (2006.01); C23C 16/02 (2006.01); H01L 21/311 (2006.01); C08F 120/14 (2006.01); B05D 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0271 (2013.01); B05D 1/327 (2013.01); B05D 3/02 (2013.01); B05D 3/107 (2013.01); B05D 3/148 (2013.01); B05D 7/14 (2013.01); C08F 8/00 (2013.01); C08F 112/08 (2013.01); C09D 1/00 (2013.01); C09D 5/008 (2013.01); C09D 7/20 (2018.01); C09D 7/61 (2018.01); C09D 125/06 (2013.01); C09D 125/16 (2013.01); C09D 133/12 (2013.01); C09D 183/04 (2013.01); C23C 16/0227 (2013.01); H01L 21/02118 (2013.01); H01L 21/02271 (2013.01); H01L 21/02282 (2013.01); H01L 21/02334 (2013.01); H01L 21/02359 (2013.01); H01L 21/31133 (2013.01); H01L 21/321 (2013.01); H01L 21/768 (2013.01); B05D 1/005 (2013.01); B05D 2518/10 (2013.01); C08F 120/14 (2013.01); C08F 2810/40 (2013.01);
Abstract

A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including silicon. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the silicon. The first region preferably contains a silicon oxide, a silicon nitride, or a silicon oxynitride. The base material preferably further includes a second region that is other than the first region and that contains a metal; and the method preferably further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film.

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