The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Mar. 31, 2020
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Ching-Pin Hsu, Tainan, TW;

Chih-Jung Wang, Tainan, TW;

Chu-Chun Chang, Kaohsiung, TW;

Kuo-Yuh Yang, Hsinchu County, TW;

Chia-Huei Lin, Hsinchu, TW;

Purakh Raj Verma, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/482 (2006.01); H01L 21/02 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01); H01L 23/485 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4821 (2013.01); H01L 21/02164 (2013.01); H01L 21/02167 (2013.01); H01L 21/02211 (2013.01); H01L 21/7682 (2013.01); H01L 21/76243 (2013.01); H01L 23/485 (2013.01);
Abstract

A semiconductor structure with an air gap includes a dielectric stack having a first dielectric layer on a substrate, a second dielectric layer on the first dielectric layer, and a third dielectric layer on the second dielectric layer. A first conductive layer and a second conductive layer are disposed in the dielectric stack. The first conductive layer and the second conductive layer are coplanar. A cross-like-shaped air gap is disposed in the dielectric stack between the first and second conductive layers. An oxide layer is disposed on a sidewall of the second dielectric layer within the cross-like-shaped air gap.


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