The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Aug. 28, 2018
Applicant:
Amkor Technology, Inc., Tempe, AZ (US);
Inventors:
Jin Young Khim, Seoul, KR;
Ji Young Chung, Gyeonggi-do, KR;
Ju Hoon Yoon, Gyeonggi-do, KR;
Kwang Woong Ahn, Seoul, KR;
Ho Jeong Lim, Seoul, KR;
Tae Yong Lee, Gyeonggi-do, KR;
Jae Min Bae, Seoul, KR;
Assignee:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/76885 (2013.01); H01L 23/481 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 24/09 (2013.01); H01L 24/81 (2013.01); H01L 23/49833 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/105 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68363 (2013.01); H01L 2224/05023 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/8185 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81894 (2013.01); H01L 2224/81895 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01);
Abstract
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.