The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

May. 22, 2018
Applicants:

Global Unichip Corporation, Hsinchu, TW;

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yu-Ting Shih, Hsinchu, TW;

Chen-Wei Hung, Hsinchu, TW;

Jia-Liang Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/40 (2006.01); H01L 23/04 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 23/04 (2013.01); H01L 23/041 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/14361 (2013.01); H01L 2924/20104 (2013.01);
Abstract

A solid-state storage device includes a housing, a wiring board and a semiconductor package unit. The housing is formed with a heat-dissipating recess thereon. The wiring board is fixed in the housing. One side of the semiconductor package unit is mounted on the wiring board, and the other side of the semiconductor package unit is embedded in the heat-dissipating recess. A top surface and lateral surfaces surrounding the top surface of the semiconductor package unit are all thermally connected to the housing in the heat-dissipating recess.


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