The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Dec. 15, 2014
Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Hirokazu Nishimaki, Toyama, JP;

Keisuke Hashimoto, Toyama, JP;

Rikimaru Sakamoto, Toyama, JP;

Takafumi Endo, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/09 (2006.01); G03F 7/11 (2006.01); G03F 7/20 (2006.01); C08G 12/08 (2006.01); C08G 8/16 (2006.01); H01L 21/033 (2006.01); C09D 161/22 (2006.01); G03F 7/32 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C08G 8/16 (2013.01); C08G 12/08 (2013.01); C09D 161/22 (2013.01); G03F 7/091 (2013.01); G03F 7/20 (2013.01); G03F 7/2059 (2013.01); G03F 7/32 (2013.01); H01L 21/0332 (2013.01); H01L 21/3081 (2013.01);
Abstract

A resist underlayer film which has an excellent hard mask function and can form an excellent pattern shape. A resist underlayer film-forming composition to be used for a lithography process, including a novolac polymer obtained by reaction of an aldehyde compound and an aromatic compound having a secondary amino group. The novolac polymer contains a unit structure of Formula (1): A method for producing a semiconductor device, including the steps of: forming a resist underlayer film from the resist underlayer film-forming composition on a semiconductor substrate; forming a hard mask on the resist underlayer film; further forming a resist film on the hard mask; forming a resist pattern by irradiation with light or an electron beam and development; etching the hard mask by using the formed resist pattern; etching the resist underlayer film by using the patterned hard mask; and processing the semiconductor substrate by using the patterned underlayer film.


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