The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Aug. 23, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Robin Hsin Kuo Chao, Cohoes, NY (US);

Mary Breton, Troy, NY (US);

Huai Huang, Saratoga, NY (US);

Dexin Kong, Guilderland, NY (US);

Lawrence A. Clevenger, Saratoga Springs, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); G01N 21/47 (2006.01); G06N 5/02 (2006.01); G06N 20/00 (2019.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/47 (2013.01); G06N 5/02 (2013.01); G06N 20/00 (2019.01); G01N 2201/126 (2013.01);
Abstract

A method for machine learning enhanced optical-based screening for in-line wafer testing includes receiving optical spectra data for a wafer-under-test by performing scatterometry on the wafer-under-test, performing predictive model screening by applying a predictive model based on the optical spectra data, determining whether a device associated with the wafer-under-test is defective based on the predictive model screening, and if the device is determined to be defective, dynamically modifying a yield map associated with the wafer-under-test, including reassigning at least one die.


Find Patent Forward Citations

Loading…