The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Dec. 29, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Vijay K. Nair, Mesa, AZ (US);
Digvijay Ashokkumar Raorane, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01P 3/12 (2006.01); H01P 11/00 (2006.01); H04B 7/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/481 (2013.01); H01L 23/5381 (2013.01); H01P 3/121 (2013.01); H01P 11/002 (2013.01); H04B 7/00 (2013.01); H01L 25/0655 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01); H01L 2924/15192 (2013.01);
Abstract
An integrated circuit (IC) comprises a substrate, a first die mounted on the substrate, a second die mounted on the substrate and a waveguide structure mounted on the first die and the second die to enable high frequency wireless communication between the first die and the second die.