The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Dec. 28, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Andrew J. Brown, Chandler, AZ (US);

Prithwish Chatterjee, Tempe, AZ (US);

Lauren A. Link, Chandler, AZ (US);

Sai Vadlamani, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01F 1/20 (2006.01); H01L 23/498 (2006.01); H01F 41/02 (2006.01); H05K 1/18 (2006.01); H01F 1/37 (2006.01); H01F 1/28 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01F 1/20 (2013.01); H01F 1/28 (2013.01); H01F 1/37 (2013.01); H01F 41/02 (2013.01); H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H05K 1/181 (2013.01); H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81207 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19042 (2013.01);
Abstract

An inductor may be fabricated comprising a magnetic material layer and an electrically conductive via or trace extending through the magnetic material layer, wherein the magnetic material layer comprises dielectric magnetic filler particles within a carrier material. Further embodiments may include incorporating the inductor of the present description into an electronic substrate and may further include an integrated circuit device attached to the electronic substrate and the electronic substrate may further be attached to a board, such as a motherboard.


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