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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11185895 B1

PDFFull Text
Date of Patent:
Nov. 30, 2021

Filed:

Mar. 12, 2019

Substrate processing method, substrate processing apparatus, and composite processing apparatus

Applicant:

Toshiba Memory Corporation, Tokyo, JP;

Inventors:

Mana Tanabe, Kanagawa, JP;

Hideaki Sakurai, Kanagawa, JP;

Kosuke Takai, Kanagawa, JP;

Kyo Otsubo, Tokyo, JP;

Minako Inukai, Kanagawa, JP;

Assignee:

TOSHIBA MEMORY CORPORATION, Tokyo, JP;

Attorney:

Finnegan, Henderson, Farabow, Garrett & Dunner L.L.P.

Primary Examiner:

Rita P Adhlakha

Assistant Examiner:

Omair Chaudhri

Int. Cl.
CPC ...
B08B 7/00 (2006.01); B08B 3/10 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B08B 7/0092 (2013.01); B08B 3/10 (2013.01); H01L 21/02057 (2013.01); H01L 21/6715 (2013.01); H01L 21/67051 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01);
Abstract

According to one embodiment, a first liquid is supplied on a first face of a substrate. The first liquid has a pH with which a surface zeta potential of the substrate becomes negative and a surface zeta potential of a foreign substance attaching to the first face becomes positive. Then, a solidified layer in which at least part of the first liquid has been solidified is formed by cooling the substrate down to be equal to or lower than a solidification point of the first liquid. Thereafter, the solidified layer is melted.

Find Patent Forward Citations

Tanabe, Mana. (2021). Substrate processing method, substrate processing apparatus, and composite processing apparatus (U.S. Patent No. 11185895). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11185895

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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