The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Oct. 24, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chia-Yu Wei, Tainan, TW;

Hsin-Chi Chen, Tainan, TW;

Kuo-Cheng Lee, Tainan, TW;

Ping-Hao Lin, Tainan, TW;

Hsun-Ying Huang, Tainan, TW;

Yen-Liang Lin, Tainan, TW;

Yu Ting Kao, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14607 (2013.01); H01L 27/1461 (2013.01); H01L 27/1463 (2013.01); H01L 27/14612 (2013.01); H01L 27/14621 (2013.01); H01L 27/14636 (2013.01); H01L 27/14641 (2013.01); H01L 27/14689 (2013.01); H01L 27/1464 (2013.01); H01L 27/14627 (2013.01); H01L 27/14645 (2013.01); H01L 27/14647 (2013.01); H01L 27/14687 (2013.01);
Abstract

The present disclosure relates to a CMOS image sensor, and an associated method of formation. In some embodiments, the CMOS image sensor comprises a floating diffusion region disposed at one side of a transfer gate within a substrate and a photo detecting column disposed at the other side of the transfer gate opposing to the floating diffusion region within the substrate. The photo detecting column comprises a doped sensing layer with a doping type opposite to that of the substrate. The photo detecting column and the substrate are in contact with each other at a junction interface comprising one or more recessed portions. By forming the junction interface with recessed portions, the junction interface is enlarged compared to a previous p-n junction interface without recessed portions, and thus a full well capacity of the photodiode structure is improved.


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