The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Apr. 19, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Chao-Tzung Tsai, Taichung, TW;

Tzu Ken Lin, Taichung, TW;

I-Chang Wu, Taichung, TW;

Ching-Lun Lai, Taichung, TW;

Li-Jia Liou, Chiayi, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 14/54 (2006.01); C23C 16/52 (2006.01); C23C 16/44 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); C23C 16/4405 (2013.01); C23C 16/52 (2013.01);
Abstract

A semiconductor manufacturing apparatus includes an air distributor inside a chamber. The air distributor includes a first annular plate and a second annular plate disposed in an interior volume of the chamber, and an inner surface of the first annular plate and an inner surface of the second annular plate are connected to each other. A hollow region is defined by the first annular plate and the second annular plate. A gas through hole is extended from an outer surface of the first annular plate to the inner surface of the first annular plate. A plurality of ditches are between the inner surface of the first annular plate and the inner surface of the second annular plate, wherein the ditches are connected with the gas through hole and extended from the gas through hole to the hollow region to blow gas toward the hollow region.


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