The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Apr. 06, 2020
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventors:
Mario Giuseppe Saggio, Aci Bonaccorsi, IT;
Simone Rascuna', San Giovanni La Punta, IT;
Assignee:
STMicroelectronics S.r.l., Agrate Brianza, IT;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/872 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/16 (2006.01); H01L 21/225 (2006.01); H01L 21/768 (2006.01); H01L 23/535 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/872 (2013.01); H01L 21/2253 (2013.01); H01L 21/76897 (2013.01); H01L 23/535 (2013.01); H01L 29/0623 (2013.01); H01L 29/1608 (2013.01); H01L 29/417 (2013.01); H01L 29/6606 (2013.01); H01L 29/66143 (2013.01); H01L 29/2003 (2013.01);
Abstract
A switching device including: a body of semiconductor material, which has a first conductivity type and is delimited by a front surface; a contact layer of a first conductive material, which extends in contact with the front surface; and a plurality of buried regions, which have a second conductivity type and are arranged within the semiconductor body, at a distance from the contact layer.