The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Jan. 16, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Andreas Meiser, Sauerlach, DE;

Caspar Leendertz, Munich, DE;

Anton Mauder, Kolbermoor, DE;

Roland Rupp, Lauf, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/16 (2006.01); H01L 29/06 (2006.01); H01L 29/417 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 29/04 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/02529 (2013.01); H01L 29/0623 (2013.01); H01L 29/0696 (2013.01); H01L 29/402 (2013.01); H01L 29/417 (2013.01); H01L 29/41766 (2013.01); H01L 29/42376 (2013.01); H01L 29/66068 (2013.01); H01L 29/7804 (2013.01); H01L 29/7813 (2013.01); H01L 29/045 (2013.01); H01L 29/0649 (2013.01); H01L 29/407 (2013.01); H01L 29/7396 (2013.01); H01L 29/7397 (2013.01);
Abstract

A method of manufacturing a silicon carbide device includes: forming a trench in a process surface of a silicon carbide substrate that has a body layer forming second pn junctions with a drift layer structure, wherein the body layer is between the process surface and the drift layer structure and wherein the trench exposes the drift layer structure; implanting dopants through a bottom of the trench to form a shielding region that forms a first pn junction with the drift layer structure; forming dielectric spacers on sidewalls of the trench; and forming a buried portion of an auxiliary electrode in a bottom section of the trench, the buried portion adjoining the shielding region.


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