The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Oct. 01, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Oscar van der Straten, Guilderland Center, NY (US);
Kenneth C. K. Cheng, Albany, NY (US);
Joseph F. Maniscalco, Lake Katrine, NY (US);
Koichi Motoyama, Clifton Park, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 21/02 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76888 (2013.01); H01L 21/02244 (2013.01); H01L 21/02247 (2013.01); H01L 21/76885 (2013.01); H01L 23/5226 (2013.01); H01L 23/53252 (2013.01);
Abstract
Integrated chips and methods of forming the same include forming a lower conductive line over an underlying layer. An upper conductive via is formed over the lower conducting lines. An encapsulating layer is formed on the lower conductive line and the upper conductive via using a treatment process that converts an outermost layer of the lower conductive line and the upper conductive via into the encapsulating layer.