The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
Oct. 07, 2016
Applied Materials, Inc., Santa Clara, CA (US);
Schubert S. Chu, San Francisco, CA (US);
Douglas E. Holmgren, Portland, OR (US);
Kartik Shah, Sunnyvale, CA (US);
Palamurali Gajendra, Bangalore, IN;
Nyi O. Myo, San Jose, CA (US);
Preetham Rao, Bangalore, IN;
Kevin Joseph Bautista, San Jose, CA (US);
Zhiyuan Ye, San Jose, CA (US);
Martin A. Hilkene, Gilroy, CA (US);
Errol Antonio C. Sanchez, Tracy, CA (US);
Richard O. Collins, Santa Clara, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber may include a substrate support, a first plurality of heating elements disposed over the substrate support, and one or more high-energy radiant source assemblies disposed over the first plurality of heating elements. The one or more high-energy radiant source assemblies are utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.