The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
Oct. 31, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Hsueh-Chung Chen, Cohoes, NY (US);
Yongan Xu, Niskayuna, NY (US);
Lawrence A. Clevenger, Saratoga Springs, NY (US);
Yann Mignot, Slingerlands, NY (US);
Cornelius Brown Peethala, Slingerlands, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 21/027 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); G03F 7/00 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/09 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0338 (2013.01); G03F 7/0035 (2013.01); G03F 7/091 (2013.01); G03F 7/16 (2013.01); G03F 7/2004 (2013.01); G03F 7/2022 (2013.01); H01L 21/0217 (2013.01); H01L 21/0276 (2013.01); H01L 21/02115 (2013.01); H01L 21/02123 (2013.01); H01L 21/02266 (2013.01); H01L 21/0332 (2013.01); H01L 21/0337 (2013.01); H01L 21/31051 (2013.01); G03F 7/203 (2013.01); H01L 21/02126 (2013.01);
Abstract
A semiconductor device includes at least one mandrel including a dielectric material, and at least one non-mandrel including a hard mask material having an etch property substantially similar to that of the dielectric material.