The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Jan. 30, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Eiji Nakamura, Kanagawa, JP;

Toyohiro Aoki, Kanagawa, JP;

Takashi Hisada, Tokyo, JP;

Risa Miyazawa, Kanagawa, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/50 (2013.01); H01L 2224/13 (2013.01); H01L 2924/14 (2013.01);
Abstract

A method for fabricating a resist structure is presented. The method includes preparing a substrate on which plural conductive pads are formed; and patterning a lower resist to form plural lower cavities. The lower resist is deposited above the substrate. Each of the plural lower cavities are located above a corresponding one of the plural conductive pads. Additionally, the method includes patterning an upper resist to form plural upper cavities. The upper resist is deposited on the lower resist. Each of the plural upper cavities are located on a corresponding one of the plural lower cavities and have a diameter larger than a diameter of the corresponding one of the plural lower cavities.


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