The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Sep. 23, 2019
Applicant:

Carl Zeiss Smt Gmbh, Oberkochen, DE;

Inventors:

Steffen Bezold, Nuremberg, DE;

Stephan Six, Augsburg, DE;

Assignee:

CARL ZEISS SMT GMBH, Oberkochen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/06 (2006.01); G01J 3/45 (2006.01); C03C 15/00 (2006.01); H01J 37/305 (2006.01);
U.S. Cl.
CPC ...
G01B 11/0675 (2013.01); G01B 11/0683 (2013.01); G01J 3/45 (2013.01); C03C 15/00 (2013.01); H01J 37/3053 (2013.01);
Abstract

A method for determining material removal by an ion beam () on a test workpiece () which is disposed in a machining chamber () of a housing () of a device () for beam machining, wherein the test workpiece () has a substrate () and a layer () applied to the substrate. The method includes a) optically determining a layer thickness (d) of the layer applied to the substrate, b) removing material of the layer from the test workpiece with the ion beam, c) optically determining the layer thickness (d) of the layer applied to the substrate, and d) determining the material removal by comparing the layer thickness determined in step a) with the layer thickness determined in step c). Also disclosed is a device () for beam machining a workpiece () with which the method can be carried out.


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