The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Jul. 29, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Fan-Shuen Meng, New Taipei, TW;

Huang-Kui Chen, Hsinchu, TW;

Min-Yann Hsieh, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/76 (2006.01); H01L 27/06 (2006.01); H01L 49/02 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 27/07 (2006.01); H01L 23/485 (2006.01); H01L 21/311 (2006.01); H01L 27/112 (2006.01); H01L 27/24 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 21/76802 (2013.01); H01L 21/76816 (2013.01); H01L 21/76831 (2013.01); H01L 21/76844 (2013.01); H01L 21/76846 (2013.01); H01L 23/485 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H01L 23/5228 (2013.01); H01L 27/0738 (2013.01); H01L 27/1085 (2013.01); H01L 27/10879 (2013.01); H01L 28/20 (2013.01); H01L 28/60 (2013.01); H01L 28/91 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 27/0733 (2013.01); H01L 27/10811 (2013.01); H01L 27/11206 (2013.01); H01L 27/2436 (2013.01); H01L 29/785 (2013.01);
Abstract

The present disclosure provides an integrated circuit (IC) structure that includes a fin active region on a substrate; a metal gate stack on the fin active region; a source and a drain on the fin active region, wherein the metal gate stack spans from the source to the drain; an interlayer dielectric (ILD) layer disposed on the source and the drain; a first conductive feature and a second conductive feature formed in the ILD layer and being aligned on the source and the drain, respectively; and a dielectric material layer surrounding the first and second conductive features. The dielectric material layer continuously extends to a bottom surface of the first conductive feature and isolates the first conductive feature from the source and the second conductive feature contacts the drain.


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