The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Dec. 17, 2019
Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Hyakka Nakada, Tokyo, JP;

Takeshi Ohmori, Tokyo, JP;

Tatehito Usui, Tokyo, JP;

Masaru Kurihara, Tokyo, JP;

Naoyuki Kofuji, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 13/04 (2006.01); H01L 21/67 (2006.01); G05B 13/02 (2006.01); H01L 21/308 (2006.01); H01L 21/66 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67276 (2013.01); G05B 13/0265 (2013.01); G05B 13/042 (2013.01); H01L 21/67069 (2013.01); H01L 21/308 (2013.01); H01L 21/3065 (2013.01); H01L 22/20 (2013.01);
Abstract

A sample simulates a processing state of a semiconductor sample and is measured by a measurement device. The sample includes: a first surface formed at a first height when viewed from a sample surface; a second surface formed at a second height higher than the first height; and a plurality of inflow parts which allow a particle for performing processing on the first surface to flow between the first surface and the second surface. The processing by the particle flowing from the inflow parts is superimposed in at least a part of a region to be processed on the first surface, and the region where the processing is superimposed on the first surface is measured by the measurement device.


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