The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Sep. 17, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chieh-Ning Feng, Taichung, TW;

Chih-Chang Hung, Hsinchu, TW;

Bing-Hung Chen, San-Xia Town, TW;

Yih-Ann Lin, Jhudong Township, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 29/6681 (2013.01); H01L 21/32139 (2013.01);
Abstract

A method includes forming a gate dielectric layer, forming a metal gate strip over a bottom portion of the gate dielectric layer, and performing a first etching process on the metal gate strip to remove a portion of the metal gate strip. The first etching process is performed anisotropically. After the first etching process, a second etching process is performed on the metal gate strip to remove a residue portion of the metal gate strip. The second etching process includes an isotropic etching process. A dielectric material is filled into a recess left by the etched portion and the etched residue portion of the metal gate strip.


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