The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Jun. 05, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kentaro Yoshihara, Koshi, JP;

Yuichi Yoshida, Koshi, JP;

Naoki Shibata, Koshi, JP;

Kousuke Yoshihara, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 3/10 (2006.01); B05D 3/06 (2006.01); B05D 1/00 (2006.01); B05C 5/00 (2006.01); H01L 51/00 (2006.01); H01L 21/027 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
B05D 3/107 (2013.01); B05C 5/002 (2013.01); B05D 1/005 (2013.01); B05D 3/065 (2013.01); H01L 21/0273 (2013.01); H01L 21/31058 (2013.01); H01L 51/00 (2013.01); H01L 51/0018 (2013.01);
Abstract

A film forming method for forming a coating film by applying a coating solution onto a substrate having projections and recesses formed on a surface thereof by a predetermined pattern, includes: applying the coating solution onto the surface of the substrate to form a thick film having a depth of projections and recesses on a surface of the film of a predetermined value or less and having a film thickness larger than a target film thickness of the coating film; and removing the surface of the thick film to form the coating film having the target film thickness.


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