The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Jul. 12, 2018
Applicant:
Shinkawa Ltd., Tokyo, JP;
Inventors:
Assignee:
SHINKAWA LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); B65G 47/91 (2006.01); H01L 21/67 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); B65G 47/91 (2013.01); H01L 21/67144 (2013.01); H01L 21/67242 (2013.01); H01L 21/67259 (2013.01); H01L 22/12 (2013.01); H01L 24/75 (2013.01); H01L 24/78 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 21/52 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/78702 (2013.01); H01L 2224/78744 (2013.01); H01L 2224/78753 (2013.01); H01L 2224/78824 (2013.01); H01L 2224/81123 (2013.01); H01L 2224/81129 (2013.01); H01L 2224/83123 (2013.01); H01L 2224/83129 (2013.01); H01L 2224/85123 (2013.01); H01L 2224/85129 (2013.01);
Abstract
This mounting device () comprises: a base () that moves linearly in relation to a substrate (); a bonding head () that is attached to the base (); a camera () that is attached to the base () and identifies the position of the substrate (); a linear scale () having a plurality of graduations along the movement direction; a bonding head-side encoder head (); and a camera-side encoder head (). A control unit () causes the base () to move to a position where the bonding head-side encoder head () detects the position of a graduation. Due to this configuration, positioning accuracy of a semiconductor die () in relation to the substrate () is improved.