The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2021

Filed:

Nov. 05, 2018
Applicant:

Stmicroelectronics, Inc., Coppell, TX (US);

Inventors:

Qing Liu, Irvine, CA (US);

Pierre Morin, Kessel-Lo, BE;

Assignee:

STMicroelectronics, Inc., Coppell, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 27/12 (2006.01); H01L 21/8238 (2006.01); H01L 21/308 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/324 (2006.01); H01L 27/092 (2006.01); H01L 21/84 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1211 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/02592 (2013.01); H01L 21/02598 (2013.01); H01L 21/02694 (2013.01); H01L 21/3081 (2013.01); H01L 21/31051 (2013.01); H01L 21/324 (2013.01); H01L 21/823807 (2013.01); H01L 21/823821 (2013.01); H01L 21/845 (2013.01); H01L 27/0924 (2013.01); H01L 29/0649 (2013.01); H01L 29/1054 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/7849 (2013.01);
Abstract

A tensile strained silicon layer is patterned to form a first group of fins in a first substrate area and a second group of fins in a second substrate area. The second group of fins is covered with a tensile strained material, and an anneal is performed to relax the tensile strained silicon semiconductor material in the second group of fins and produce relaxed silicon semiconductor fins in the second area. The first group of fins is covered with a mask, and silicon-germanium material is provided on the relaxed silicon semiconductor fins. Germanium from the silicon germanium material is then driven into the relaxed silicon semiconductor fins to produce compressive strained silicon-germanium semiconductor fins in the second substrate area (from which p-channel finFET devices are formed). The mask is removed to reveal tensile strained silicon semiconductor fins in the first substrate area (from which n-channel finFET devices are formed).


Find Patent Forward Citations

Loading…