The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2021

Filed:

May. 09, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Shih-Yu Liao, Hsinchu, TW;

Shih-Chi Kuo, Yangmei, TW;

Tsai-Hao Hung, Hsinchu, TW;

Tsung-Hsien Lee, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/14 (2006.01); G01N 21/956 (2006.01); G01N 21/95 (2006.01); G03B 19/00 (2021.01); G03F 7/30 (2006.01); H01L 21/67 (2006.01); G03B 9/08 (2021.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G01B 11/14 (2013.01); G01N 21/9501 (2013.01); G01N 21/956 (2013.01); G03B 9/08 (2013.01); G03B 19/00 (2013.01); G03F 7/3028 (2013.01); G03F 7/70616 (2013.01); H01L 21/67155 (2013.01);
Abstract

The present disclosure is directed to a method and system for monitoring a distance between a shutter and a reference point in a processing module. For example, the method includes moving a shutter relative to a substrate support in a wafer processing module and determining a distance between the shutter and a wall of the wafer processing module with a measurement device. In response to the distance being greater than a value, the method further includes transferring a substrate to the substrate support, and in response to the distance being equal to or less than the value, the method includes resetting the shutter.


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