The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
Nov. 04, 2019
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05D 11/13 (2006.01); B01F 15/00 (2006.01); B01F 3/08 (2006.01); G03F 7/20 (2006.01); G05D 21/02 (2006.01);
U.S. Cl.
CPC ...
B01F 15/00422 (2013.01); B01F 3/0861 (2013.01); B01F 15/00227 (2013.01); G03F 7/2041 (2013.01); G03F 7/70341 (2013.01); G05D 11/132 (2013.01); G05D 11/138 (2013.01); G05D 11/139 (2013.01); G05D 21/02 (2013.01); Y10T 137/2499 (2015.04); Y10T 137/2509 (2015.04);
Abstract
A method includes mixing a first deionized water (DI) water from a first pipe and a second DI water from a second pipe in a merging pipe that is in fluid communication with the first pipe and the second pipe. An electrical resistivity of the first DI water is different from an electrical resistivity of the second DI water. A mixture of the first DI water and the second DI water is applied from the merging pipe onto a wafer.