The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Dec. 28, 2016
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Ra-Min Tain, Taoyuan, TW;

Kai-Ming Yang, Taoyuan, TW;

Wang-Hsiang Tsai, Taoyuan, TW;

Tzyy-Jang Tseng, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H05K 3/46 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 21/4846 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/147 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H05K 1/03 (2013.01); H05K 1/11 (2013.01); H05K 3/4673 (2013.01); H01L 23/145 (2013.01); H01L 23/15 (2013.01); H01L 23/49816 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/3511 (2013.01); H05K 1/0271 (2013.01); H05K 1/0306 (2013.01); H05K 1/0313 (2013.01); H05K 3/4682 (2013.01); H05K 3/4694 (2013.01); H05K 2201/10674 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A circuit board includes a composite layer of a non-conductor inorganic material and an organic material, a plurality of conductive structures, a first built-up structure, and a second built-up structure. The composite layer of the non-conductor inorganic material and the organic material has a first surface and a second surface opposite to each other and a plurality of openings. The conductive structures are respectively disposed in the openings of the composite layer of the non-conductor inorganic material and the organic material. The first built-up structure is disposed on the first surface of the composite layer of the non-conductor inorganic material and the organic material and electrically connected to the conductive structures. The second built-up structure is disposed on the second surface of the composite layer of the non-conductor inorganic material and the organic material and electrically connected to the conductive structures.


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