The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Jul. 16, 2019
Applicant:

Tohoku University, Sendai, JP;

Inventors:

Soshi Sato, Sendai, JP;

Masaaki Niwa, Sendai, JP;

Hiroaki Honjo, Sendai, JP;

Shoji Ikeda, Sendai, JP;

Hideo Ohno, Sendai, JP;

Tetsuo Endo, Sendai, JP;

Assignee:

TOHOKU UNIVERSITY, Sendai, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/08 (2006.01); H01L 43/12 (2006.01); G11C 11/16 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 43/08 (2013.01); G11C 11/161 (2013.01); H01L 22/20 (2013.01); H01L 43/12 (2013.01);
Abstract

A structure used in the formation of a spintronics element, the spintronics element to include a plurality of laminated layers, includes a substrate, a plurality of laminated layers formed on the substrate, an uppermost layer of the plurality of laminated layers being a non-magnetic layer containing oxygen, and a protection layer directly formed on the uppermost layer, the protection layer preventing alteration of characteristics of the uppermost layer while exposed in an atmosphere including HO, a partial pressure of HO in the atmosphere being equal to or larger than 10Pa, no other layer being directly formed on the protection layer.


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