The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Nov. 07, 2016
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Shigehiro Miura, Iwate, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/50 (2006.01); C23C 16/52 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45544 (2013.01); C23C 16/45502 (2013.01); C23C 16/45534 (2013.01); C23C 16/45551 (2013.01); C23C 16/45563 (2013.01); C23C 16/45578 (2013.01); C23C 16/50 (2013.01); C23C 16/52 (2013.01);
Abstract

A plasma processing method is provided. In the plasma processing method, a plurality of types of mixed gases is supplied to a plurality of areas on a film deposited on a surface of a substrate. The plurality of types of mixed gases contains a plurality types of noble gases. The plurality of types of mixed gases has different mix proportions of the plurality types of noble gases from each other. The plurality of types of mixed gases is converted to plasma. A plasma process is performed by using the mixed gases converted to the plasma on the film.


Find Patent Forward Citations

Miura, Shigehiro. (2021). Plasma processing method and plasma processing apparatus (U.S. Patent No. 11118264). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11118264

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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