The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Apr. 25, 2019
Tokyo Electron Limited, Tokyo, JP;
Hisashi Inoue, Iwate, JP;
Masahiro Kobayashi, Iwate, JP;
Michihiro Takahashi, Iwate, JP;
Tamotsu Hatakeyama, Iwate, JP;
Harunari Hasegawa, Iwate, JP;
Hiroshi Kikuchi, Iwate, JP;
Yoshihisa Kumagai, Iwate, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed inside the reaction tube through the opening while the reaction tube is held by the lift; gas supply source configured to supply a gas into the reaction tube through the gas supply pipe while the reaction tube is held by the lift; and an exhaust mechanism including a pump configured to exhaust an inside of the reaction tube through the opening, thereby performing a leakage test of the reaction tube while the reaction tube is held by the lift.