The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Jul. 24, 2019
Applicant:

Versum Materials Us, Llc, Tempe, AZ (US);

Inventors:

Matthias Stender, Phoenix, AZ (US);

Agnes Derecskei, Fountain Hills, AZ (US);

Bradley J. Brennan, Omaha, NE (US);

Assignee:

VERSUM MATERIALS US, LLC, Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/06 (2006.01); H01L 21/321 (2006.01); C09G 1/02 (2006.01); C09K 13/00 (2006.01);
U.S. Cl.
CPC ...
C09K 13/06 (2013.01); C09G 1/02 (2013.01); C09K 13/00 (2013.01); H01L 21/3212 (2013.01);
Abstract

This invention pertains to compositions, methods and systems that can be used in chemical mechanical planarization (CMP) of a tungsten containing semiconductor device. CMP slurries comprising bicyclic amidine additives provide low dishing and low erosion topography.


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