The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Dec. 11, 2018
Disco Corporation, Tokyo, JP;
Kazuma Sekiya, Tokyo, JP;
Naoki Murazawa, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A recess or through-hole forming method for forming a substrate with a recess or a through-hole along a thickness direction of the substrate, the method including: a modified region forming step of applying a laser beam of such a wavelength as to be transmitted through the substrate to the substrate, with a focal region of the laser beam positioned inside the substrate, to form a column-shaped modified region which is exposed to a surface of the substrate and extends along the thickness direction of the substrate; and an etching step of etching the modified region to form the substrate with the recess or the through-hole, after the modified region forming step is performed.