The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Oct. 01, 2020
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventors:
Chih-Cheng Fu, New Taipei, TW;
Ming-Che Lin, Taichung, TW;
Assignee:
WINBOND ELECTRONICS CORP., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01); H01L 27/24 (2006.01); G11C 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 45/1246 (2013.01); G11C 13/004 (2013.01); G11C 13/0007 (2013.01); G11C 13/0069 (2013.01); H01L 27/2463 (2013.01); H01L 45/08 (2013.01); H01L 45/1233 (2013.01); H01L 45/1253 (2013.01); H01L 45/146 (2013.01); H01L 45/1675 (2013.01); G11C 2013/0045 (2013.01); G11C 2013/0078 (2013.01);
Abstract
A RRAM array and its manufacturing method are provided. The RRAM array includes a substrate having an array region which has a first region and a second region. The RRAM array includes a bottom electrode layer on the substrate, an oxygen ion reservoir layer on the bottom electrode layer, a diffusion barrier layer on the oxygen ion reservoir layer, a resistance switching layer on the diffusion barrier layer, and a top electrode layer on the resistance switching layer. The diffusion barrier layer in the first region is different from the diffusion barrier layer in the second region.