The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Feb. 01, 2018
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Keisuke Nakamura, Chiyoda-ku, JP;
Muneyoshi Suita, Chiyoda-ku, JP;
Akifumi Imai, Chiyoda-ku, JP;
Kenichiro Kurahashi, Chiyoda-ku, JP;
Tomohiro Shinagawa, Chiyoda-ku, JP;
Takashi Matsuda, Chiyoda-ku, JP;
Koji Yoshitsugu, Chiyoda-ku, JP;
Eiji Yagyu, Chiyoda-ku, JP;
Kunihiko Nishimura, Chiyoda-ku, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
The semiconductor manufacturing device includes: a lower substrate support base configured to support a diamond substrate; an upper substrate support base configured to support a semiconductor substrate; a support base drive unit configured to move the lower substrate support base and the upper substrate support base to bring the diamond substrate and the semiconductor substrate into close contact with each other under a state in which a pressure is applied to the diamond substrate and the semiconductor substrate in a thickness direction; and a second mechanism configured to deform a surface of the upper substrate support base opposed to the lower substrate support base so that a surface of the semiconductor substrate opposed to the diamond substrate forms a parallel surface or a parallel plane with respect to a surface of the diamond substrate opposed to the semiconductor substrate.