The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

May. 20, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;

Inventors:

Jean-Pierre Colinge, Hsinchu, TW;

Ta-Pen Guo, Taipei, TW;

Chih-Hao Wang, Baoshan Township, TW;

Carlos H. Diaz, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); H01L 29/66 (2006.01); H01L 29/775 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); H01L 29/0676 (2013.01); H01L 29/66439 (2013.01); H01L 29/775 (2013.01); H01L 29/42392 (2013.01);
Abstract

A semiconductor arrangement includes a substrate region and a first semiconductor column projecting from the substrate region. The semiconductor arrangement includes a second semiconductor column projecting from the substrate region and adjacent the first semiconductor column. The second semiconductor column is separated a first distance from the first semiconductor column along a first axis. The semiconductor arrangement includes a third semiconductor column projecting from the substrate region and adjacent the first semiconductor column. The third semiconductor column is separated a second distance from the first semiconductor column along a second axis that is substantially perpendicular to the first axis. The second distance is different than the first distance.


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