The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Dec. 25, 2015
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Zhicheng Ding, Shanghai, CN;
Bin Liu, Shanghai, CN;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 22/14 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 25/0657 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/4809 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48147 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A system in package and method for making a system in package. A plurality of passive devices are coupled to an interposer. A molding compound envelopes the plurality of passive devices and defines a platform having a substantially planar surface. The interposer is coupled to a substrate. A plurality of integrated circuit dies are coupled in a stack to the planar surface.